# Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors - Intel Newsroom

*Источник: Intel Newsroom*
*Дата: 2026-07-29*
*Язык: en*

<a href="https://news.google.com/rss/articles/CBMisAFBVV95cUxPcUlSdFFWTTZ0UVY1a2ZfVkJCeUpPaHNOQjVySU5fQW1mZFY5NTlOSXVFdW5lT0FEV0lrczdxX2xjNjUxcHcyUkpld0ZJX2hCR0RsWUhSbXRsVGtRdnRVTW1YMno3Wm9xdkFNMzFyeHYyV1QwSHZMWDFwaEJ4MVZsVlFNQkR5MEtVbDdpZk5takpwNXdremxwdWVTaVc0NEpMc0hyTDBCRTJaZEY2ZW03bw?oc=5" target="_blank">Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors</a>&nbsp;&nbsp;<font color="#6f6f6f">Intel Newsroom</font>

[Оригинал](https://newsroom.intel.com/intel-foundry/intels-us-advanced-packaging-enables-next-generation-ai-semiconductors)