# Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push - Reuters

*Источник: Reuters*
*Дата: 2026-07-25*
*Язык: en*

<a href="https://news.google.com/rss/articles/CBMi3wFBVV95cUxQVVhSemYyWk9XZmJzMXhYLXFvUm1rdElNNW0zYVktUlBGVFdtbHNJa1NBX2gwSGNVbEZpbnlYVi1CcnBvT1BiZEtNSHdDSDllMTNYQXVKMDN2UEdTS2ZOb1FPNzFBMEhpRERtOXVkODJ5ZEEycTVnRXpaTzlsX2Y5ZXdmUndUakpPUlAtaHY3NzIxczd5X3k4ODk0dW9Fenk0TzlCQ2dQaml2aURvTEgtNENFNTVodmcybEVlTGQ5Nmt4Nm9LUTJNOXV2U05jV3ByVzB5cU85OExDRWlKRjlJ?oc=5" target="_blank">Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push</a>&nbsp;&nbsp;<font color="#6f6f6f">Reuters</font>

[Оригинал](https://www.reuters.com/business/autos-transportation/samsung-elec-wins-200-billion-broadcom-ai-chip-partnership-boosting-foundry-push-2026-07-25/)