# Cadence rolls out AI agent to speed circuit board, chip packaging design - Reuters

*Источник: Reuters*
*Дата: 2026-07-15*
*Язык: en*

<a href="https://news.google.com/rss/articles/CBMiswFBVV95cUxQMmZaRXBtUG5RLWpZQjg4UjFZd012cTM1Uy0xZy13SkkxamJiSzVuZ0dIMGllZDZVZGJKMkItTlo4bzliUGdndlY2ZG1JYTlpY0Z0a3lEWERtZDE5ZGY0VlA5WEYxaXJvSkZUMDBaUkxkekF5b2NQamFhdHRUVEM3aVRwNkw4VFlPa2M3VWtOa1cyNGUtVGRzOHhGdVJYVUw2aHpVZV91TmpUWjFWQ25STmwtMA?oc=5" target="_blank">Cadence rolls out AI agent to speed circuit board, chip packaging design</a>&nbsp;&nbsp;<font color="#6f6f6f">Reuters</font>

[Оригинал](https://www.reuters.com/business/cadence-rolls-out-ai-agent-speed-circuit-board-chip-packaging-design-2026-07-15/)